Skip links

K-Bond universal

Light-curing dental adhesive

K-Bond Universal by Kiyomi Dental is an eighth-generation, single-component, self-etching, light-curing universal dental adhesive designed to provide reliable bonding in direct and indirect restorative procedures. Its versatility allows it to be used with self-etch, total-etch or selective-etch techniques, adapting to different clinical situations and substrates.

Its formulation contains the functional monomer 10-MDP (10-methacryloyloxydecyl dihydrogen phosphate), which promotes chemical bonding to dental tissues and various restorative materials. K-Bond Universal can be used on enamel and dentine and is suitable for a range of restorative interfaces, including composite, ceramic, zirconia and metal alloys.

K-Bond Universal provides a bond strength to the tooth surface of at least 20 MPa, together with a low film thickness of approximately 3 µm. Its ultra-mild pH of 2.7 and ability to penetrate dentinal tubules promote stable bonding and effective sealing.

It is also compatible with light-cured, self-cured and dual-cured composite resin cements. Its low microleakage helps seal the adhesive interface and reduce the risk of postoperative sensitivity, providing a versatile system for multiple restorative procedures.

Clinical features

  • Light-curing universal dental adhesive.
  • Eighth-generation, single-component system.
  • Self-etching adhesive.
  • Smart double-seal cap design to prevent solvent (ethanol) evaporation.
  • Compatible with self-etch, total-etch and selective-etch techniques.
  • Contains the functional monomer 10-MDP (10-methacryloyloxydecyl dihydrogen phosphate).
  • Suitable for enamel, dentine and various restorative substrates.
  • Compatible with composite, ceramic, zirconia and metal alloys.
  • Compatible with light-cured, self-cured and dual-cured cements.
  • Bond strength to the tooth surface: ≥20 MPa.
  • Film thickness: approximately 3 µm.
  • Ultra-mild pH: 2.7.
  • High penetration into dentinal tubules.
  • Low microleakage.
  • Presentation: 6 ml bottle.

Light-curing dental adhesive

K-Bond Universal by Kiyomi Dental is an eighth-generation, single-component, self-etching, light-curing universal dental adhesive designed to provide reliable bonding in direct and indirect restorative procedures. Its versatility allows it to be used with self-etch, total-etch or selective-etch techniques, adapting to different clinical situations and substrates.

Its formulation contains the functional monomer 10-MDP (10-methacryloyloxydecyl dihydrogen phosphate), which promotes chemical bonding to dental tissues and various restorative materials. K-Bond Universal can be used on enamel and dentine and is suitable for a range of restorative interfaces, including composite, ceramic, zirconia and metal alloys.

K-Bond Universal provides a bond strength to the tooth surface of at least 20 MPa, together with a low film thickness of approximately 3 µm. Its ultra-mild pH of 2.7 and ability to penetrate dentinal tubules promote stable bonding and effective sealing.

It is also compatible with light-cured, self-cured and dual-cured composite resin cements. Its low microleakage helps seal the adhesive interface and reduce the risk of postoperative sensitivity, providing a versatile system for multiple restorative procedures.

Clinical features

  • Light-curing universal dental adhesive.
  • Eighth-generation, single-component system.
  • Self-etching adhesive.
  • Smart double-seal cap design to prevent solvent (ethanol) evaporation.
  • Compatible with self-etch, total-etch and selective-etch techniques.
  • Contains the functional monomer 10-MDP (10-methacryloyloxydecyl dihydrogen phosphate).
  • Suitable for enamel, dentine and various restorative substrates.
  • Compatible with composite, ceramic, zirconia and metal alloys.
  • Compatible with light-cured, self-cured and dual-cured cements.
  • Bond strength to the tooth surface: ≥20 MPa.
  • Film thickness: approximately 3 µm.
  • Ultra-mild pH: 2.7.
  • High penetration into dentinal tubules.
  • Low microleakage.
  • Presentation: 6 ml bottle.

INDICATED FOR

Indicated for direct bonding beneath light-cured composite or compomer restorations; cementation of indirect dental restorations with composite resin cement; intraoral repair of ceramic, composite and metal alloy restorations in combination with light-cured composite; bonding to various restorative substrates, including metal and zirconia; and sealing hypersensitive areas of teeth.

CLINICAL BENEFITS

K-Bond Universal by Kiyomi Dental offers a simple, versatile universal adhesive system for restorative dentistry. Its formulation with the monomer 10-MDP (10-methacryloyloxydecyl dihydrogen phosphate), compatibility with different etching techniques and restorative materials, and high bond strength allow clinicians to perform direct and indirect procedures using a single adhesive system.

Universal application

Compatible with different bonding techniques and multiple substrates, allowing a single adhesive to be used in a wide range of restorative procedures.

Chemical bonding with 10-MDP

The functional monomer 10-MDP promotes chemical interaction with dental tissues and certain restorative materials, including zirconia and metals.

High bond strength

It provides a bond strength to the tooth surface of at least 20 MPa, contributing to reliable bonding in direct and indirect restorations.

Thin adhesive film

Its film thickness of approximately 3 µm promotes a uniform adhesive interface and minimises interference with the seating and aesthetics of restorations.

CLINICAL BENEFITS

K-Bond Universal by Kiyomi Dental offers a simple, versatile universal adhesive system for restorative dentistry. Its formulation with the monomer 10-MDP (10-methacryloyloxydecyl dihydrogen phosphate), compatibility with different etching techniques and restorative materials, and high bond strength allow clinicians to perform direct and indirect procedures using a single adhesive system.

Universal application

Compatible with different bonding techniques and multiple substrates, allowing a single adhesive to be used in a wide range of restorative procedures.

Chemical bonding with 10-MDP

The functional monomer 10-MDP promotes chemical interaction with dental tissues and certain restorative materials, including zirconia and metals.

High bond strength

It provides a bond strength to the tooth surface of at least 20 MPa, contributing to reliable bonding in direct and indirect restorations.

Thin adhesive film

Its film thickness of approximately 3 µm promotes a uniform adhesive interface and minimises interference with the seating and aesthetics of restoration

Etching versatility

Etching versatility

It can be used with self-etch, total-etch or selective-etch techniques, allowing the bonding protocol to be adapted to the needs of each clinical situation.

Compatibility with different cementation systems

Compatibility with different cementation systems

It can be used with light-cured, self-cured and dual-cured resin cements.

Effective dentine sealing

Effective dentine sealing

Its ability to penetrate dentinal tubules and its low microleakage help seal the dentine and reduce postoperative sensitivity. Its smart double-seal cap allows clinicians to work with one hand without assistance, preserving the integrity of the product’s formulation by preventing solvent (ethanol) evaporation and unnecessary spills.

Do you need additional information?

CONTACT US

    Explore
    Drag